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SIMPLE TECHNOLOGY, INC. FORM 10-K ANNUAL REPORT TABLE OF CONTENTS
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 10-K
FOR ANNUAL AND TRANSITION REPORTS PURSUANT TO SECTIONS 13 OR 15(d)
OF THE SECURITIES EXCHANGE ACT OF 1934
(Mark One)
/x/ |
ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 |
For the fiscal year ended December 31, 2000
OR
| / / | TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 |
For the transition period from to
Commission file number 000-31623
SIMPLE TECHNOLOGY, INC.
(Exact Name of Registrant as Specified in Its Charter)
| California (State or Other Jurisdiction of Incorporation or Organization) |
33-0399154 (I.R.S. Employer Identification No.) |
3001 Daimler Street
Santa Ana, California 92705-5812
(Address of principal executive offices, including zip code)
Registrant's Telephone Number, Including Area Code: (949) 476-1180
Securities registered pursuant to Section 12(b) of the Act: None
Securities registered pursuant to Section 12(g) of the Act:
Title of each class |
Name of each exchange on which registered |
|
| Common Stock, $0.001 par value | The Nasdaq National Market |
Indicate by check mark whether the registrant: (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. Yes /x/ No / /
Indicate by a check mark if disclosure of delinquent filers pursuant to Item 405 of Regulation S-K is not contained herein, and will not be contained, to the best of registrant's knowledge, in definitive proxy or information statements incorporated by reference in Part III of this Form 10-K or any amendment to this Form 10-K. / /
As of March 20, 2001, the approximate aggregate market value of voting stock held by non-affiliates of the registrant was $22,926,298.00 (based upon the closing price for shares of the Registrant's Common Stock as reported by The National Market System of the National Association of Securities Dealers Automated Quotation System on that date). Shares of Common Stock held by each officer, director, and holder of 5% or more of the outstanding Common Stock have been excluded in that such persons may be deemed to be affiliates. This determination of affiliate status is not necessarily a conclusive determination for other purposes.
As of March 20, 2001, there were approximately 37,653,000 shares of Common Stock outstanding.
SIMPLE TECHNOLOGY, INC.
FORM 10-K ANNUAL REPORT
TABLE OF CONTENTS
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Page |
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|---|---|---|---|---|---|
| PART I. | 1 | ||||
| ITEM 1. | BUSINESS | 1 | |||
| ITEM 2. | PROPERTIES | 23 | |||
| ITEM 3. | LEGAL PROCEEDINGS | 23 | |||
| ITEM 4. | SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS | 25 | |||
PART II. |
26 |
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| ITEM 5. | MARKET FOR THE REGISTRANT'S COMMON STOCK AND RELATED SHAREHOLDER MATTERS | 26 | |||
| ITEM 6. | SELECTED FINANCIAL DATA | 27 | |||
| ITEM 7. | MANAGEMENT'S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS | 29 | |||
| ITEM 7A. | QUANTITATIVE AND QUALITATIVE DISCLOSURES ABOUT MARKET RISK | 35 | |||
| ITEM 8. | FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA | 35 | |||
| ITEM 9. | CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURE | 35 | |||
PART III. |
36 |
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| ITEM 10. | DIRECTORS AND EXECUTIVE OFFICERS OF THE REGISTRANT | 36 | |||
| ITEM 11. | EXECUTIVE COMPENSATION | 39 | |||
| ITEM 12. | SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT | 43 | |||
| ITEM 13. | CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS | 45 | |||
PART IV. |
50 |
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| ITEM 14. | EXHIBITS, FINANCIAL STATEMENT SCHEDULES, AND REPORTS ON FORM 8-K | 50 | |||
In this Report, "Simple Technology," "we," "us" and "our" refer to Simple Technology, Inc., a California corporation, and our subsidiaries. We own or have rights to product names and trademarks that we use in conjunction with the sale of our products, including Simple®, Simple Technology®, SiliconTech, IC Tower and CompactFlash. The CompactFlash Association makes the CompactFlash name and logo available royalty-free to its member companies. References in this Report to CompactFlash are references only to our products unless otherwise indicated. This report also contains other product names, trade names and trademarks that belong to other organizations.
i
This Annual Report on Form 10-K, including information incorporated herein by reference, contains "forward-looking statements" within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. These statements relate to expectations concerning matters that are not historical facts. Words such as "projects," "believes," "anticipates," "will," "estimate," "plans," "expects," "intends," and similar words and expressions are intended to identify forward-looking statements. Although we believe that such forward-looking statements are reasonable, we cannot assure you that such expectations will prove to be correct. Important language regarding factors which could cause actual results to differ materially from such expectations are disclosed in this Report, including without limitation under the caption "Risk Factors" beginning on page 15 of this Report, and in our Registration Statement on Form S-1 (No. 333-32478) declared effective by the Securities and Exchange Commission ("SEC") on September 28, 2000. All forward-looking statements attributable to Simple Technology are expressly qualified in their entirety by such language. We do not undertake any obligation to update any forward-looking statements.
Overview
Simple Technology is a technology solutions provider offering products based on dynamic random access memory, or DRAM, static random access memory, or SRAM, and Flash memory technologies. We design, manufacture and market a comprehensive line of custom and standard memory and storage products, as well as connectivity products that connect memory cards and hard drive upgrade kits to PCs. These products are used in high performance computing, networking and communications, consumer electronics and industrial applications. Examples of these applications include desktop and notebook computers, servers, routers, switches, digital cameras, digital video recorders, MP3 digital audio players, personal digital assistants, or PDAs, embedded controls and medical instruments. Our patented IC Tower stacking technology allows multiple memory chips to be stacked together to increase the capabilities of memory modules without increasing the product footprint. This technology allows our customers to design memory intensive systems on a more competitive basis. Our CompactFlash cards provide portable digital devices, such as digital cameras and MP3 digital audio players, with increased storage capabilities in a smaller size product. We believe our design, manufacturing, test and logistics expertise, along with our proprietary technologies, enable us to respond to our customers' rapidly changing product and service requirements. We provide our customers timely access to higher speed and higher density memory products, increasing their ability to bring products to market quickly, and decreasing their production and inventory costs.
We offer custom and standard memory solutions to original equipment manufacturers, or OEMs, and aftermarket customers including value added resellers, or VARs, mail order customers, commercial and industrial distributors, and retailers. We believe our comprehensive line of products allows our customers to efficiently manage their inventory purchases by consolidating their sources for memory, storage and connectivity products. Our OEM Division, known as SiliconTech, primarily sells custom memory products for newly manufactured systems, with most sales based on a coordinated design effort between us and our OEM customers. In 2000, our principal OEM customers, including sales through their fulfillment partners, were Cisco Systems, Lucent Technologies, Motorola, Silicon Graphics and Unisys. Our Aftermarket Division primarily sells custom and standard memory and storage products which are mainly used as upgrades to existing systems. In 2000, our principal aftermarket customers included CDW Computer Centers, Costco Wholesale, Ingram Micro, Insight Direct and PC Connection. Other than Cisco Systems and CDW Computer Centers, no customer accounted for more than 10.0% of our total revenues in 2000.
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Industry Background
The development of high performance PCs and servers and the evolution of the Internet infrastructure have increased the demand for greater capabilities in the storage, manipulation, transfer and management of digital data. Digital computing and processing have extended beyond traditional computer systems, such as PCs and servers, to include a wide array of networking and communications, consumer electronics and industrial applications, including routers, switches, digital cameras, digital video recorders, MP3 digital audio players, PDAs, embedded controls and medical instruments. The increased functionality and decreased size of many of these products have led to a greater demand for higher density memory products with smaller size, lower power consumption and higher speeds at a lower cost.
The memory market can be divided into several types of integrated circuit, or IC, devices that are designed to perform specific functions within computer and other electronic systems. Three significant types of memory IC devices are DRAM, SRAM and Flash. DRAM and SRAM are considered volatile memory since they require a constant power supply to retain data. Since Flash is able to retain data without a power source, it is considered non-volatile memory. Within each of these categories, manufacturers are offering an increasing variety of memory products that are designed for different applications and performance requirements. This increasing variety has placed greater demands on manufacturers of computer and other electronic systems to maintain engineering expertise.
DRAM is a high density, low cost per bit, random access memory component which stores digital information in the form of bits and provides high speed storage and retrieval of data. SRAM performs memory functions similar to DRAM, but is much faster and does not require the memory modules to be electronically refreshed. Flash memory is a solid-state, non-volatile technology that can be used as an alternative to rotating disk drives. Flash is noiseless, considerably lighter, more rugged and consumes substantially less power than a rotating disk drive.
The Simple Technology Solution
Simple Technology designs, manufactures and markets a comprehensive line of memory, storage and connectivity products used in high performance computing, networking and communications, consumer electronics and industrial applications.
Our products offer the following features:
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We offer our OEM customers a comprehensive technology solution from concept to design to the creation of prototypes through high volume production and testing. We believe our quick-turn design capabilities and automated manufacturing and test processes allow our OEM customers to quickly and cost-effectively bring products to market. This outsourcing also allows our OEM customers to focus their resources on activities and technologies in which they add the greatest value, such as system design, sales, marketing and distribution. We believe our technical capabilities and volume manufacturing strengths allow our OEM customers to cost-effectively design and implement customized, advanced memory chip technology in high volume product applications.
Our aftermarket customers include VARs, mail order customers, commercial and industrial distributors, and retailers. We believe our comprehensive line of products allows our aftermarket customers to efficiently manage their inventory purchases by consolidating their sources for memory, storage and connectivity products. We are able to strengthen our relationships with these aftermarket customers and develop the Simple Technology brand name through various marketing programs. We also provide ongoing customer support, including on-line pricing and navigation tools, toll-free technical support and account manager training programs. For further details regarding our various marketing programs, see "BusinessSales and Marketing."
Design, Manufacturing and Test Engineering
Design and production. The typical production cycle consists of a design stage followed by a prototype stage and ends with full production of the final product. The length of the design stage has been reduced due to rapid improvements in technology. In recent years customers have demanded shorter design and production cycles. In response, we have developed quick-turn design and manufacturing services. By working with our OEM customers early in the design and prototype stages, we are able to resolve critical design issues effectively and efficiently, thus shortening the time from prototype design to volume manufacturing. In addition, working closely with our OEM customers throughout the design and production stages allows us to gain important insights into their future product requirements. We believe our quick-turn design and manufacturing services also allow us to introduce upgrade products to the aftermarket on a timely basis to coincide with new product releases by these customers.
Manufacturing. Our manufacturing processes are highly automated and involve the use of specialized equipment for the production of memory products. Our manufacturing systems have been optimized to support the placement of a large number of IC devices on each memory board. We believe we are able to achieve a high manufacturing yield and minimize direct labor costs as a result of our design efficiencies, high level of automation and general manufacturing expertise. Because our manufacturing systems can be easily configured for different memory products, we have the ability to offer our customers short manufacturing and test cycles on small and large projects. We also have developed an automated method of manufacturing our IC Tower stacking products which we believe results in further manufacturing efficiencies. Our OEM Division manufacturing is ISO 9001 certified.
Test engineering. An important aspect of our manufacturing operations is our focus on test engineering. We test 100% of our memory products upon completion of manufacturing, which results in lower returns due to product defects. We believe our test engineering expertise will continue to grow in importance as the speed and complexity of memory products increase. Our test engineering group develops proprietary processes which, together with our continued investment in advanced testing equipment, enable us to consistently produce high quality products.
Research and Development
Our research and development efforts are focused on developing reliable, high performance and cost-effective memory products to address the needs of traditional and emerging memory applications. We believe the timely development of new products is essential to maintaining our competitive
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position. Our engineering staff works closely with our OEM customers and provides services throughout the production cycle, including component selection, schematic design, layout, manufacturing and test engineering expertise. We design our products to be compatible with existing industry standards and, where appropriate, develop and promote new standards. An important aspect of our engineering operations is to understand the challenges presented by our OEM customers' custom design requirements and satisfy them by utilizing our proprietary technologies and our technical expertise. In the course of meeting our customers' challenges, we are often required to develop new technologies and processes which are later added to our design library for use by our other customers. Our design library consists of over 1,000 designs that are available for a wide variety of custom and standard product configurations. We focus primarily on new high speed memory modules, improvements in manufacturing processes and technologies, and improvements in test routines and related software. We plan to continue to direct our research and development efforts toward the design of new memory products which address the requirements of our OEM and aftermarket customers.
In the Flash market, our research and development is directed toward the design and introduction of new Flash products that provide improved storage capacities, higher speed read and write capabilities, smaller sizes and new interfaces. These products are intended for networking and communications, consumer electronics and industrial applications.
Our IC Tower stacking technology enables us to produce high density DRAM and Flash products by manufacturing products in a three-dimensional form. These products offer higher density capabilities in the same footprint than the traditional two-dimensional designs. We stack unmodified memory devices to produce higher density and smaller form factor DRAM modules and Flash cards. This capability enables us to shorten our customers' design cycles for high density products to lead times normally associated with non-stacked memory solutions.
Products
We design, manufacture and market a comprehensive line of over 2,500 memory, storage and connectivity products using our proprietary design and manufacturing technologies. Substantially all of our DRAM, SRAM and Flash memory products comply with industry standards and are based on a variety of industry architectures. Sales of memory products accounted for 91.0% of our revenues in 2000.
DRAM Products
We offer DRAM products including a wide range of single in-line memory modules, or SIMMs, dual in-line memory modules, or DIMMs, and small outline dual in-line memory modules, or SO DIMMs. Our standard DRAM products are available in various configurations of up to 184 pins and densities of up to 512 megabytes. We also offer many of these products in 3.3 volt or 5.0 volt configurations utilizing different DRAM architectures such as DDR, SDRAM, RDRAM, EDO and FPM.
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The following table describes certain of our non-stacking DRAM products as of March 1, 2001:
| DRAM Product Family |
Density |
Architecture |
Speed (MHz) |
Applications |
||||
|---|---|---|---|---|---|---|---|---|
| 184-pin DIMM | 64-512MB | DDR | 200-266 | Servers and workstations | ||||
Rambus DIMM |
64-512MB |
RDRAM |
600-800 |
Desktop PCs, embedded controls and workstations |
||||
168-pin and 184-pin Registered DIMM |
64-512MB |
DDR, SDRAM |
66-133 |
Desktop PCs, embedded controls, networking and communications equipment, printers, routers, servers and workstations |
||||
168-pin and 184-pin DIMM |
16-512MB |
DDR, SDRAM, EDO, FPM |
10-133 |
Desktop PCs, embedded controls, networking and communications equipment, printers, routers, servers and workstations |
||||
144-pin SO DIMM |
16-256MB |
SDRAM, EDO, FPM |
10-133 |
Embedded controls, networking and communications equipment, notebook PCs, printers and routers |
||||
100-pin DIMM |
16-64MB |
SDRAM, EDO, FPM |
33-133 |
Networking and communications equipment, printers and terminals |
||||
72-pin SO DIMM |
16-64MB |
EDO, FPM |
10-33 |
Networking and communications equipment, and notebook PCs |
||||
72-pin SIMM |
16-128MB |
EDO, FPM |
10-33 |
Desktop PCs, embedded controls, networking and communications equipment, printers, routers and servers |
||||
Flash Products
We manufacture three types of Flash products: Flash modules, Linear Flash PC Cards and data storage Flash products. Flash modules and Linear Flash PC Cards are commonly used in program and code storage applications such as networking and communications and embedded applications. Data storage Flash products are commonly used where data storage is the primary function, such as in digital cameras, MP3 digital audio players, certain networking and communications and embedded applications, and ruggedized computers built to withstand shock and vibration.
Flash modules. We offer standard, custom and application-specific Flash modules, including 168-pin Asynchronous DIMMs, 144-pin SO DIMM, 80-pin Asynchronous SIMMs and 72-pin DRAM/Flash combination SIMMs. Our Flash modules are available in densities of up to 64 megabytes. We offer additional options such as on-board active reset control and system reset. Many of these products are available in 3.3 volt or 5.0 volt configurations.
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The following table describes certain of our Flash modules as of March 1, 2001:
| Flash Module Product Family |
Density |
Architecture |
Applications |
|||
|---|---|---|---|---|---|---|
| 168-pin DIMM | 4-16MB | 3.3 volt or 5.0 volt | Networking and communications equipment, printers and switches | |||
144-pin SO DIMM |
32-128MB |
3.3 volt |
Networking |
|||
80-pin SIMM |
2-64MB |
12.0 volt/5.0 volt programming, 5.0 volt only, 3.3 volt only, reset options |
Networking and communications equipment, printers and switches |
|||
72-pin DRAM/Flash SIMM |
8MB Flash 56MB DRAM |
Plugs into the DRAM socket; reads and writes like DRAM |
Networking and communications equipment |
|||
Linear Flash PC Cards. We offer standard, custom and application-specific Linear Flash PC Cards, with densities ranging from 512 kilobytes to 64 megabytes.
The following table describes certain of our Linear Flash PC Cards as of March 1, 2001:
| Linear Flash PC Card Product Family |
Density |
Features |
Applications |
|||
|---|---|---|---|---|---|---|
| 68-pin PC Card | 512KB-64MB | Plug and play, compatible to Intel based series 1, 2, 2+ and Value Series 100 and 200 PC Cards | Medical equipment, networking and communications equipment, notebook PCs, PDAs and test equipment | |||
68-pin PC Card |
1MB-64MB |
Plug and play, compatible to series C and D AMD cards |
Medical equipment, networking and communications equipment, PDAs and test equipment |
|||
Data storage Flash products. We offer a broad line of data storage Flash products in various capacities, sizes and operating voltages and temperatures. Our current product families include CompactFlash, ATA Flash PC Cards, solid-state Flash drives and Flash Disk Modules. Our data storage Flash products are compatible with a majority of today's industry-standard computing and communications systems.
CompactFlash. Our CompactFlash products provide full PC Card ATA functionality but are only one-fourth the size of a standard PC Card. CompactFlash's small size, durability, low power consumption and ability to operate at either 3.3 volts or 5.0 volts make it well-suited for a range of current and next-generation, small size consumer applications such as audio recorders, digital cameras, MP3 digital audio players and PDAs. CompactFlash products provide interoperability with systems based on the PC Card ATA standard by using a low cost passive adapter.
ATA Flash PC Cards. Our ATA Flash PC Cards are used in storage, data backup and data logging applications. Our products are available in PC Card Type I, II and III form factors.
Solid-state Flash drives. Our solid-state Flash drives are available in 2.5 inch and 3.5 inch hard disk form factors and are targeted at applications that require embedded data storage devices. Our solid-state Flash drives offer rugged, portable, low power data storage and are
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compatible replacements for rotating hard drives, making them ideal for notebook computers, communication devices, and networking and communications applications requiring embedded storage.
Flash Disk Modules. Our Flash Disk Module products offer a transparent design, replacing or augmenting conventional IDE hard disk drives by leveraging from a miniature module footprint that allows these products to be used as components in embedded systems. Specifically, the product line is available in a 40-pin configuration which addresses similar functionality to a 2.5 inch hard disk drive, a 44-pin configuration which addresses similar functionality to 3.5 inch hard disk drive, and a standard 144-pin SO DIMM configuration.
The following table describes certain of our data storage Flash products as of March 1, 2001:
| Data Storage Flash Product Family |
Density |
Form Factor |
||
|---|---|---|---|---|
| CompactFlash | 8-320MB | Type I (36.4mm x 42.8mm x 3.3mm) | ||
| ATA Flash PC Card | 8MB-2GB | Type I (54.0mm x 85.6mm x 3.3mm) | ||
| Type II (54.0mm x 85.6mm x 5.0mm) | ||||
| Type III (54.0mm x 85.6mm x 10.0mm) | ||||
| Solid-state Flash drives | 8MB-2GB | 2.5 inch and 3.5 inch | ||
| Flash Disk Modules - 40-pin | 32-160MB | 40-pin vertical & horizontal | ||
| Flash Disk Modules - 44-pin | 32-160MB | 44-pin vertical & horizontal | ||
| Flash Disk Modules - 144-pin | 32-512MB | 144-pin SO DIMM |
Stacking DRAM and Flash Card Products
DRAM modules and Flash card products. We offer custom and application-specific stacking DRAM modules including a wide range of DIMMs and SO DIMMs. Our stacking DRAM modules are available in various configurations of up to 200-pins and densities of up to 1 gigabyte. We also offer many of these modules in both 3.3 volt and 5.0 volt configurations utilizing different DRAM architectures such as DDR, SDRAM, EDO and FPM. Our IC Tower stacking technology has enabled us to offer a 512 megabyte Type II CompactFlash card, which is one of the highest capacity CompactFlash cards currently available.
The following table describes certain of our stacking DRAM and Flash card products as of March 1, 2001:
| Stacking DRAM Product Family |
Density |
Architecture |
Speed (MHz) |
Applications |
||||
|---|---|---|---|---|---|---|---|---|
| 200-pin Registered DIMM | 256-512MB | SDRAM | 66-133 | Servers | ||||
168-pin and 184-pin Registered DIMM |
256MB-1GB |
DDR, SDRAM |
66-133 |
Desktop PCs, embedded controls, networking and communications equipment, printers, routers, servers and workstations |
||||
168-pin DIMM |
256MB-1GB |
SDRAM, EDO, FPM |
10-133 |
Desktop PCs, embedded controls, networking and communications equipment, printers, routers, servers and workstations |
||||
144-pin SO DIMM |
128MB-1GB |
SDRAM |
66-133 |
Embedded controls, networking and communications equipment, notebook PCs and routers |
||||
| Stacking Flash Card Product Family |
Density |
Form Factor |
||
|---|---|---|---|---|
| CompactFlash | 512MB | Type II (36.4mm × 42.8mm × 5.0mm) |
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IC Tower stacking components. Our patented IC Tower stacking technology is a high density memory design architecture that uses standard DRAM IC devices to create high capacity components. We offer a wide selection of stacked components to be used on memory modules and on our customers' specific applications. This technology is used in complex, high capacity module designs and systems and offers chip densities that are less expensive than non-stacked components on a per megabit basis.
The following table describes certain of our IC Tower stacking components as of March 1, 2001:
| IC Tower Stacking Product Family |
Density |
Architecture |
Speed (MHz) |
Applications |
||||
|---|---|---|---|---|---|---|---|---|
| DDR | 128-512MB | 2 High (64-256MB) |
200-266 | Standard and application-specific memory modules and systems | ||||
SDRAM |
128-512MB |
2 High (64-256MB) |
66-133 |
Standard and application-specific memory modules and systems |
||||
EDO/FPM |
128MB |
2 High (64MB) |
10-33 |
Standard and application-specific memory modules and systems |
||||
SRAM Products
We offer a comprehensive line of standard, custom and application-specific SRAM modules and PC Cards, including synchronous, asynchronous and battery backup low power SRAM devices. Our SRAM products are available in densities of up to 8 megabytes. Many of these products are available in 3.3 volt or 5.0 volt configurations.
The following table describes certain of our SRAM products as of March 1, 2001:
| SRAM Product Family |
Density |
Speed (MHz) |
Applications |
|||
|---|---|---|---|---|---|---|
| Custom ZBT | 4-8MB | 133-200 | Networking and communications equipment | |||
PC Card |
512KB-6MB |
6.6-10 |
Embedded systems, industrial control test equipment and networking and communications equipment |
|||
72-pin SIMM |
2-8MB |
66-100 |
Networking and communications equipment |
|||
64-pin SIMM |
1MB |
66-83 |
Networking and communications equipment |
|||
Other Products
Hard drive upgrade kits. We offer hard drive upgrade kits for many major brands of notebook PCs. Our products range from 6 to 30 gigabytes. The primary use of these products is to enhance the storage capacity of notebook PCs. We also offer USB data transfer/backup kits for desktop and notebook PCs.
Connectivity products. We offer connectivity products that connect PC Cards, CompactFlash cards and hard drive upgrade kits to a PC's parallel port or USB port. These products allow the user to move information from their PC Card, CompactFlash card or hard drive to their desktop or notebook PC.
Customers
OEM Division
In 2000, our OEM Division sold to over 150 customers directly and through industrial distributors and contract manufacturers who incorporate our products into systems they assemble for OEMs. We
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define our OEM customers as OEMs who have purchased our products directly or ordered our products from industrial distributors and contract manufacturers. OEMs make the purchasing decisions on substantially all of the products we sell through industrial distributors and contract manufacturers. Our largest OEM customer, Cisco Systems, accounted for 31.8% of our OEM revenues or 14.6% of our total revenues in 2000. No other OEM customer accounted for more than 10.0% of our total revenues in 2000. The following table lists our top five OEM customers based on revenues in 2000, including sales to their industrial distributors and contract manufacturers. We have no long-term contracts with these customers.
| Customer |
Market Segment/Distribution Channel |
|
|---|---|---|
| Cisco Systems | Networking equipment | |
| Lucent Technologies | Communications equipment | |
| Motorola | Single board computers | |
| Silicon Graphics | Desktop PCs, enterprise servers and workstations | |
| Unisys | Mainframes and servers |
Aftermarket Division
In 2000, our Aftermarket Division sold to over 1,500 customers through a variety of distribution channels including VAR, mail order, commercial and industrial distribution, and retail. Our largest aftermarket customer, CDW Computer Centers, accounted for 31.2% of our aftermarket revenues or 16.8% of our total revenues in 2000. No other aftermarket customer accounted for more than 10.0% of our total revenues in 2000. The following table lists our top five aftermarket customers based on revenues in 2000. We have no long-term contracts with these customers.
| Customer |
Distribution Channel |
|
|---|---|---|
| CDW Computer Centers | Mail order | |
| Costco Wholesale | Retail | |
| Ingram Micro | Commercial distribution | |
| Insight Direct | Mail order | |
| PC Connection | Mail order |
In addition, through our commercial distribution arrangements, we supply certain of our products to e-commerce companies, including Buy.com and Egghead.com, for their sale of these products on the internet.
We expect that sales of our products to a small number of customers will continue to contribute materially to our revenues for the foreseeable future and believe that our financial results will depend in significant part upon the success of our customers' business. We have also experienced changes in the composition of our major customer base from quarter to quarter as the market demand for our customers' products changes and we expect this variability will continue in the future.
Sales and Marketing
OEM Division
Our OEM Division uses an internal direct sales force complemented by an external sales force of manufacturers' representatives and industrial distributors for sales to OEM customers in the United States and internationally. We pursue our customer base on both a geographic and account specific basis. We believe these combined sales forces have the local presence, market knowledge and strategic insight to allow us to more effectively market our products to a larger number of OEMs. In addition, as part of our sales and marketing efforts, our experienced applications engineers work closely with our OEM customers in designing our products into their systems.
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Aftermarket Division
We ship Simple Technology brand-name products directly to VARs, mail order customers, commercial and industrial distributors, and retailers. As of December 31, 2000, our products were available in more than 800 retail stores. In addition to in-house sales representatives, our sales efforts in the aftermarket channel are supported by manufacturers' representatives. For the mail order and retail channels, we advertise in magazines and newspapers as a way of bringing end-users to our customers' locations. Some of our aftermarket customers also feature our products in their advertisements in exchange for a fee. We offer certain VARs volume rebates and work with their customers to qualify our products for their information system departments. Volume rebates are used to incentivize resellers, rewarding them with a rebate for our products sold. For commercial distributors, we purchase corporate image advertising, offer volume rebates and joint marketing programs, and generate leads at tradeshows and refer those potential customers to our distributors. Through joint marketing programs, we work with resellers to incorporate the Simple Technology brand in the resellers' existing marketing plans, such as catalogs and web banner ads. Lead generation comes from end users who visit our website, fill out our product registration cards, visit our booths at trade shows, and call us in response to advertisements and direct mail. In addition, we have developed direct advertising programs with certain of our commercial distributors' e-commerce customers in which we market our products on their websites. We also offer account manager incentives which include sales contests and reward programs designed to sustain reseller loyalty while also creating excitement for increased sales activity.
Customer Service and Support
We provide our customers with comprehensive product service and support. We work closely with our OEM customers to monitor the performance of their product designs and to provide application design and support. This also provides us with insight into defining their subsequent generations of products. Our standard OEM support package is generally offered with all product sales and includes full technical documentation and application design assistance. During our OEM customers' production phase, we provide extensive support which includes training, system-level design, implementation and integration support. We believe that tailoring our technical support to our OEM customers' needs is essential for the success of our product introductions and customer satisfaction. Our aftermarket customers receive technical support on an unlimited, toll-free basis and are assigned a dedicated technician familiar with their account. We also train account managers of aftermarket customers to keep them informed about changes in our product lines. In addition, we offer aftermarket customers on-line pricing and navigation tools, and a personalized web page available through our extranet which features personalized information such as promotions, new products and contact information.
Competition
We conduct business in an industry characterized by intense competition, rapid technological change, evolving industry standards, declining average sales prices and rapid product obsolescence. Our competitors include many large domestic and international companies that have substantially greater financial, technical, marketing, distribution and other resources, broader product lines, lower cost structures, greater brand recognition and long-standing relationships with customers and suppliers.
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Our primary competitors in 2000 included:
| Component Manufacturers |
Module/PC Card Assemblers |
Stacking Memory Manufacturers |
||
|---|---|---|---|---|
| Advanced Micro Devices Hitachi Semiconductor Intel Micron Semiconductor Electronics NEC Electronics Samsung Electronics Toshiba |
Celestica Kingston Technology SanDisk Silicon Storage Technology Solectron Viking Components |
Dense-Pac Microsystems StakTek |
We expect to face competition from existing competitors and new and emerging companies that may enter our existing or future markets with similar or alternative products, which may be less costly or provide additional features. In addition, some of our significant suppliers, including Hitachi Semiconductor, NEC Electronics and Toshiba, are also our competitors. These suppliers have the ability to manufacture competitive products at lower costs as a result of their higher levels of integration. We also face competition from current and prospective customers that evaluate our capabilities against the merits of manufacturing products internally. Competition also may arise due to the development of cooperative relationships among our current and potential competitors or third parties to increase the ability of their products to address the needs of our prospective customers. Accordingly, it is possible that new competitors or alliances among competitors may emerge and rapidly acquire significant market share.
We compete in our target markets based primarily on quality and price, design and manufacturing technology, and responsiveness to our customers' needs. We expect our competitors will continue to improve the performance of their current products, reduce their current product sales prices and introduce new products that may offer greater performance and improved pricing, any of which could cause a decline in sales or loss of market acceptance of our products.
To remain competitive, we must, among other things:
The Flash memory market is in the early stage of development. There is currently an absence of a single Flash memory standard. It is possible that Flash memory standards other than those to which our products conform will emerge as the industry standard. If we are unable to anticipate and adequately allocate our resources in a timely and efficient manner toward the production and development of industry-standard Flash memory products, we may experience significant delays in releasing new and commercially viable products. In addition, if a competing technology replaces or takes significant market share from the Flash memory market, we may not be able to sell our Flash products.
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Suppliers
IC devices represent approximately 95.0% of our component costs. We purchase these IC devices from a small number of suppliers. In 2000, our significant suppliers of IC devices included:
| DRAM IC Suppliers |
Flash IC Device Suppliers |
|
|---|---|---|
| Hitachi Semiconductor | Hitachi Semiconductor | |
| Hyundai Electronics | ||
| NEC Electronics | ||
| Samsung Semiconductor | ||
| Toshiba |
Hitachi Semiconductor supplies substantially all of the IC devices used in our Flash memory products. In addition, Hitachi Electronics, Hyundai Electronics, NEC Electronics, Samsung Semiconductor and Toshiba currently supply a majority of the DRAM IC devices used in our DRAM memory products. We have no long-term supply contracts. A disruption in or termination of our supply relationship with any of these significant suppliers would, among other things, cause delays, disruptions or reductions in product shipments or increase costs and/or prices and would harm our business. In particular, if our supply relationship with Hitachi Semiconductor is disrupted or terminated, our ability to manufacture and sell our data storage Flash products would be limited.
We are continuing to identify and establish additional sources of supply where we have supplier concentrations, although there can be no assurance that these efforts will be successful. In the future, if the demand for our products exceeds our suppliers' ability to deliver needed components, we may be placed on supplier allocation and we may be unable to meet customer demand.
Backlog
Sales of our memory products are commonly made under short-term cancelable purchase orders. We include in our backlog only those customer orders for which we have accepted purchase orders and to which we have assigned shipment dates within the upcoming six months. Since orders constituting our backlog are subject to change due to, among other things, customer cancellations and reschedulings, and our ability to procure necessary components, backlog is not necessarily an indication of future revenues. In addition, there can be no assurance that current backlog will necessarily lead to revenues in any future period. Our combined backlog was $22.4 million as of December 31, 2000. Our OEM backlog was $21.4 million as of December 31, 2000, and our aftermarket backlog was $1.0 million as of December 31, 2000. Aftermarket backlog is typically nominal since substantially all aftermarket orders are filled on a same-day or next-day basis. Our ability to predict future sales is limited because a majority of our quarterly product revenues come from orders that are received and fulfilled in the same quarter.
Intellectual Property Rights
We regard our patents, trademarks, trade secrets and other intellectual property as critical to our success. We rely on a combination of patents, trademarks, copyrights and trade secret laws, confidentiality procedures, and employee disclosure and invention assignment agreements to protect our intellectual property rights.
As of March 1, 2001, we owned eight U.S. patents, including U.S. Patent No. Re. 36,916 related to our IC Tower stacking products, and 12 additional patent applications were pending. We have one agreement to license our technology to a third party. Although the term of this license is perpetual, we believe that the licensee is currently not using this technology. In August 2000, we entered into a license agreement with Micron Electronics for the use, sale and importation into the United States of certain memory modules incorporating Micron's proprietary technology. The license agreement was
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entered into in connection with our August 22, 2000 settlement of a lawsuit originally filed by Micron on April 6, 2000 against 18 computer memory manufacturers, including us, for our alleged infringement of certain of Micron's patents. A Notice of Entry of Order was approved on August 28, 2000 by the court which dismissed the Micron lawsuit with prejudice. The impact of the license for all periods presented in the financial statements would have been immaterial.
The following table describes our patents and their expiration dates:
| U.S. Patent No. |
Expiration Date |
Description |
||
|---|---|---|---|---|
| Re. 36,916 | May 6, 2013 | Apparatus for stacking semiconductor chips | ||
5,555,209 |
September 9, 2013 |
Circuit for latching data signals from DRAM memory |
||
5,562,504 |
October 7, 2013 |
Communications card with integral transmission media line adaptor |
||
5,596,757 |
January 20, 2014 |
System and method for selectively providing termination power to a SCSI bus terminator from a host device |
||
5,660,568 |
August 25, 2014 |
Communications card with integral transmission media line adaptor |
||
5,673,419 |
September 29, 2014 |
Parity bit emulator with write parity bit checking |
||
5,826,174 |
January 22, 2016 |
Method and apparatus for improving data transmission over a wireless system by optical spectrum positioning |
||
D405,764 |
April 21, 2018 |
Adaptor for a media line connector |
||
Although we consider the patents currently held by us to be critical to our success, there can be no assurance that any patents currently held by us or any patents which may be granted to us in the future will not be challenged, invalidated or circumvented, or that rights granted thereunder will provide meaningful protection or other commercial advantage to us. There can be no assurance that third parties will not develop similar products, duplicate our products or design around the patents currently owned by us or which may be granted to us in the future. Because we view intellectual property rights as critical to our success, we intend to pursue future patents and other intellectual property rights in the U.S. There can be no assurance that we will be successful in these endeavors. In addition there can be no assurance that our trade secrets and know-how may not become known to third parties, or become part of the public domain, which in either case would harm our financial performance and business operations.
We have not applied and do not expect to apply for patent protection in foreign countries. In addition, the laws of foreign countries may not adequately protect our intellectual property rights. Many U.S. companies have encountered substantial infringement problems in some foreign countries. Because we sell some of our products overseas, we have exposure to foreign intellectual property risks.
The semiconductor industry is characterized by vigorous protection and pursuit of intellectual property rights. We believe that it may be necessary, from time to time, to initiate litigation against one or more third parties to preserve our intellectual property rights. In addition, from time to time, third parties may bring suits against us. For details regarding our pending intellectual property lawsuits, see "Legal Proceedings" and see "BusinessRisk FactorsWe are involved from time to time in litigation over intellectual property rights, which may adversely affect our ability to manufacture and sell our products."
In the event of an adverse result in any such litigation, we could be required to pay substantial damages, cease the manufacture, use and sale of certain products, expend significant resources to develop non-infringing technology, discontinue the use of certain processes or obtain licenses to use the
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infringed technology. Any litigation, whether as plaintiff or as defendant, would likely result in significant expense to us and divert the efforts of our technical and management personnel, whether or not such litigation is ultimately determined in our favor. In addition, the results of any litigation are inherently uncertain. For a discussion of our legal expenses for 2000, see "Management's Discussion and Analysis of Financial Condition and Results of Operations."
In the event we desire to incorporate third-party technology into our products or our products are found to infringe on others' patents or intellectual property rights, we may be required to license such patents or intellectual property rights. If we obtain licenses from third parties, we may be required to pay license fees or make royalty payments, which could reduce our gross margins. If we are unable to obtain a license from a third party for technology, we could incur substantial liabilities or be required to expend substantial resources redesigning our products to eliminate the infringement. There can be no assurance that we would be successful in redesigning our products or that we could obtain licenses on commercially reasonable terms, if at all. In addition, any development or license negotiations could require substantial expenditures of time and other resources by us.
As is common in the industry, we currently have in effect a number of agreements in which we have agreed to defend, indemnify and hold harmless certain of our suppliers and customers from damages and costs which may arise from the infringement by our products of third-party patents, trademarks or other proprietary rights. The scope of such indemnity varies, but may, in some instances, include indemnification for damages and expenses, including attorneys' fees. We may from time to time be engaged in litigation as a result of such indemnification obligations. In addition, our insurance does not cover intellectual property infringement.
In our efforts to maintain the confidentiality and ownership of trade secrets and other confidential information, all of our employees are required to sign employee non-disclosure and invention assignment agreements. This agreement requires our employees to disclose, document and assign their interest in all inventions, patents and copyrights developed while employed with us. Our employees further agree to preserve all of our confidential information including trade secrets, customer information, know-how and other business information. There can be no assurance that these agreements will provide meaningful protection of our trade secrets or other confidential information in the event of unauthorized use or disclosure of such information. See "Risk FactorsOur proprietary technology and intellectual property may not be adequately protected, which could harm our competitive position."
Employees
As of December 31, 2000, we had 378 full-time employees, consisting of 185 in manufacturing (including test engineering, quality assurance and material management), 111 in sales and marketing, 47 in finance and administration and 35 in design and product development. Our employees are not represented by any collective bargaining agreements and we have never experienced a work stoppage. Management believes that relations with our employees are good.
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You should carefully consider the following risks before you decide to buy shares of our common stock. The risks and uncertainties described below are not the only ones facing us. Additional risks and uncertainties, including those risks set forth in "Management's Discussion and Analysis of Financial Condition and Results of Operations" below, may also adversely impact and impair our business. If any of the following risks actually occur, our business, results of operations or financial condition would likely suffer. In such case, the trading price of our common stock could decline, and you may lose all or part of the money you paid to buy our stock.
This Report contains forward-looking statements based on the current expectations, assumptions, estimates and projections about us and our industry. These forward-looking statements involve risks and uncertainties. Our actual results could differ materially from those discussed in these forward-looking statements as a result of certain factors, as more fully described in this section and elsewhere in this Report. We do not undertake to update publicly any forward-looking statements for any reason, even if new information becomes available or other events occur in the future.
Declines in our average sales prices may result in declines in our revenues and gross margins.
In the fourth quarter of 2000, overcapacity in the memory product market negatively impacted our average selling prices. We expect this overcapacity to negatively impact our revenues and profitability for at least the first half of 2001. Declines in semiconductor prices could affect the valuation of our inventory, which could harm our business. Our ability to maintain or increase revenues will depend upon our ability to increase unit sales volumes of existing products and to introduce and sell new products in quantities sufficient to offset declines in sales prices. Our efforts to reduce costs and develop new products to offset the impact of further declines in average sales prices may not be successful. Declines in average sales prices also would result in more memory being built into products by OEMs, which would favor our largest competitors and reduce the demand for our aftermarket memory products.
Because we depend on a small number of suppliers for IC devices, any disruption in our supply relationships could harm our ability to fulfill orders.
We have no long-term supply contracts and are dependent on a small number of suppliers to supply integrated circuit, or IC, devices which represent approximately 95.0% of our component costs. Our dependence on a small number of suppliers and our lack of long-term supply contracts exposes us to several risks, including the inability to obtain an adequate supply of components, price increases, late deliveries and poor component quality. Hitachi Semiconductor supplies substantially all of the IC devices used in our data storage Flash memory products. In addition, Hitachi Semiconductor, Hyundai Electronics, NEC Electronics, Samsung Semiconductor and Toshiba currently supply a majority of the DRAM IC devices used in our DRAM memory products. A disruption in or termination of our supply relationship with any of these significant suppliers by natural disaster or otherwise, or our inability to develop relationships with new suppliers, if required, would cause delays, disruptions or reductions in product shipments or require product redesigns which could damage relationships with our customers, and would increase our costs and/or prices. In particular, if our supply relationship with Hitachi Semiconductor is disrupted or terminated, our ability to manufacture and sell our data storage Flash products would be limited and our Flash business would be adversely affected.
We are subject to the cyclical nature of the semiconductor industry and changes from the current point in the cycle could adversely affect our business.
The semiconductor industry, including the memory markets in which we compete, is highly cyclical and is characterized by constant and rapid technological change, rapid product obsolescence and price
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erosion, evolving standards, short product life cycles and wide fluctuations in product supply and demand. The industry has experienced significant downturns, often connected with, or in anticipation of, maturing product cycles of both semiconductor companies' and their customers' products and declines in general economic conditions. These downturns have been characterized by diminished product demand, production overcapacity, high inventory levels and accelerated erosion of average selling prices. Any future downturns could have a material adverse effect on our business and operating results. In the fourth quarter of 2000, a semiconductor downturn negatively impacted our average selling prices. We expect this downturn to continue for at least the first half of 2001, which we expect will negatively impact our revenues and profitability. Furthermore, any upturn in the semiconductor industry could result in increased demand for, and possible shortages of, components we use to manufacture and assemble our ICs. Such shortages could have a material adverse effect on our business and operating results.
We may be unable to maintain a steady supply of components.
The electronics industry has experienced in the past, and may experience in the future, shortages in IC devices, including DRAM, SRAM and Flash memory. We have experienced and may continue to experience delays in component deliveries and quality problems which have caused and could in the future cause delays in product shipments. In addition, we have required and could in the future require the redesign of some of our products. In addition, industry capacity has, from time to time, become constrained such that some vendors which supply components for our products have placed their customers, ourselves included, on allocation. This means that while we may have customer orders, we may not be able to obtain the materials that we need to fill those orders in a timely manner.
Sales to a small number of customers represent a significant portion of our revenues and the loss of any key customer would materially reduce our sales.
Our dependence on a small number of customers means that the loss of a major customer or any reduction in orders by a major customer would materially reduce our sales. Historically, a relatively small number of customers have accounted for a significant percentage of our revenues. Our ten largest OEM customers accounted for an aggregate of 81.3% of our OEM revenues or 37.4% of our total revenues in 2000. Our largest OEM customer, Cisco Systems, accounted for 31.8% of our OEM revenues or 14.6% of our total revenues in 2000. Our ten largest aftermarket customers accounted for an aggregate of 50.5% of our aftermarket revenues or 27.3% of our total revenues in 2000. Our largest aftermarket customer, CDW Computer Centers, accounted for 31.2% of our aftermarket revenues or 16.8% of our total revenues in 2000. Consolidation in some of our customers' industries may result in increased customer concentration and the potential loss of customers as a result of acquisitions. In addition, the composition of our major customer base changes from quarter to quarter as the market demand for our customers' products changes and we expect this variability will continue in the future. We expect that sales of our products to a small number of customers will continue to contribute materially to our revenues in the foreseeable future and believe that our financial results will depend in significant part upon the success of our customers' products.
Three of our beneficial shareholders have substantial influence over our operations and can significantly influence matters requiring shareholder approval.
Manouch Moshayedi, Mike Moshayedi and Mark Moshayedi, each of whom is an executive officer and director of Simple Technology, are brothers and beneficially own approximately 81.3% of our common stock. As a result, they have the ability to control all matters requiring approval by our shareholders, including the election and removal of directors, approval of significant corporate transactions and the ability to control the decision of whether a change in control will occur.
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We are involved from time to time in claims and litigation over intellectual property rights, which may adversely affect our ability to manufacture and sell our products.
The semiconductor industry is characterized by vigorous protection and pursuit of intellectual property rights. We believe that it may be necessary, from time to time, to initiate litigation against one or more third parties to preserve our intellectual property rights. In addition, from time to time, we have received, and may continue to receive in the future, notices that claim we have infringed upon, misappropriated or misused other parties' proprietary rights, which claims could result in litigation. Such litigation would likely result in significant expense to us and divert the efforts of our technical and management personnel. In the event of an adverse result in such litigation, we could be required to pay substantial damages, cease the manufacture, use and sale of certain products, expend significant resources to develop non-infringing technology, discontinue the use of certain processes or obtain licenses to use the infringed technology. Such a license may not be available on commercially reasonable terms, if at all. Our failure to obtain a license or our failure to obtain a license on commercially reasonable terms could cause us to incur substantial costs and suspend manufacturing products using the infringed technology. If we obtain a license, we would likely be required to make royalty payments for sales under the license. Such payments would increase our costs of revenues and reduce our gross profit.
We are currently a party to two lawsuits regarding intellectual property as further described under "Legal Proceedings." The outcome of litigation is inherently uncertain and we cannot predict the outcome of these lawsuits with certainty. These lawsuits have diverted, and are expected to continue to divert, the efforts and attention of our key management and technical personnel. In addition, we have incurred, and expect to continue to incur, substantial legal fees and expenses in connection with these lawsuits. As a result, our defense of these lawsuits, regardless of their eventual outcomes, has been, and will continue to be, costly and time consuming. In addition, if our IC Tower stacking patent is found to be invalid, our ability to exclude competitors from making, using or selling the same or similar products to our IC Tower stacking products would cease. In addition, if we are found to infringe valid patents of others, we may be excluded from using the infringed technology without a license, which may not be available on commercially reasonable terms, if at all.
If industry sales of products using Flash memory do not grow, our revenues, gross margins and profitability would be harmed.
The market for consumer electronics incorporating Flash memory is relatively new and emerging. The success of our Flash business will depend largely on the level of consumer interest in consumer electronics utilizing Flash memory, such as digital cameras, MP3 digital audio players and personal digital assistants, or PDAs, many of which have only recently been introduced to the market. If sales of products using Flash memory do not increase, we will be unable to grow our Flash business. In addition, if we are unable to anticipate and fulfill customer demand for our products, we may lose sales to our competitors.
Demand for our products would decline if the market for Flash memory does not develop, or if a competing technology displaces Flash memory.
There is currently an absence of a single Flash memory standard. It is possible that Flash memory standards other than those to which our products conform will emerge as the industry standard. If we are unable to anticipate and adequately allocate our resources in a timely and efficient manner toward the production and development of industry-standard Flash memory products, we may experience significant delays in releasing new and commercially viable products. These delays would provide a competitor a first-to-market opportunity and allow a competitor to achieve greater market share. Some of our competitors are in a better financial and marketing position from which to influence industry acceptance of a particular Flash memory standard or competing technology than we are. In particular,
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a primary source of competition may come from companies that offer alternative technologies such as ferroelectric random access memory products. If a competing technology replaces or takes significant market share from the Flash memory market, we would not be able to sell our Flash products.
The execution of our growth strategy depends on our ability to retain key personnel, including our executive officers, and to attract qualified personnel.
Competition for employees in our industry is intense. We have had and may continue to have difficulty hiring the necessary engineering, sales and marketing and management personnel to support our growth. The successful implementation of our business model and growth strategy depends on the continued contributions of our senior management and other key research and development, sales and marketing and operations personnel, including Manouch Moshayedi, our Chief Executive Officer, Mike Moshayedi, our President, and Mark Moshayedi, our Chief Operating Officer, Chief Technical Officer and Secretary. The loss of any key employee, the failure of any key employee to perform in his or her current position, or the inability of our officers and key employees to expand, train and manage our employee base would prevent us from executing our growth strategy.
Our proprietary technology and intellectual property may not be adequately protected, which could harm our competitive position.
Our proprietary technology and other intellectual property are critical to our success. We protect our intellectual property rights through patents, trademarks, copyrights and trade secret laws, confidentiality procedures and employee disclosure and invention assignment agreements. It is possible that our efforts to protect our intellectual property rights may not:
As part of our confidentiality procedures, we enter into non-disclosure and invention assignment agreements with all of our employees and attempt to control access to and distribution of our technology, documentation and other proprietary information. However, if such agreements are found to be unenforceable, we may be unable to adequately protect our intellectual property rights. In addition, despite these procedures, third parties could copy or otherwise obtain and make unauthorized use of our technologies or independently develop similar technologies.
We have not applied and do not expect to apply for patent protection in foreign countries. In addition, the laws of foreign countries may not adequately protect our intellectual property rights. Many U.S. companies have encountered substantial infringement problems in some foreign countries. Because we sell some of our products overseas, we have exposure to foreign intellectual property risks.
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Our indemnification obligations for the infringement by our products of the intellectual property rights of others could require us to pay substantial damages.
We currently have in effect a number of agreements in which we have agreed to defend, indemnify and hold harmless certain of our customers and suppliers from damages and costs which may arise from the infringement by our products of third-party patents, trademarks or other proprietary rights. We may periodically have to respond to claims and litigate these types of indemnification obligations. Any such indemnification claims could require us to pay substantial damages. Our insurance does not cover intellectual property infringement.
Our indemnification obligations to our customers and suppliers for product defects could require us to pay substantial damages.
A number of our product sales and product purchase agreements provide that we will defend, indemnify and hold harmless our customers and suppliers from damages and costs which may arise from product warranty claims or claims for injury or damage resulting from defects in our products. We maintain insurance to protect against certain claims associated with the use of our products, but our insurance coverage may not be adequate to cover all or any part of the claims asserted against us. A successful claim brought against us that is in excess of, or excluded from, our insurance coverage could substantially harm our business, financial condition and results of operations.
Our limited experience in acquiring other businesses, product lines and technologies may make it difficult for us to overcome problems encountered in connection with any acquisitions we may undertake.
While we have no agreements or negotiations currently underway, we intend to pursue selective acquisitions to complement our internal growth. If we make any future acquisitions, we could issue stock that would dilute our shareholders' percentage ownership, incur substantial debt, reduce our cash reserves or assume contingent liabilities. We have limited experience in acquiring other businesses, product lines and technologies. In addition, the attention of our small management team may be diverted from our core business if we undertake an acquisition. Potential acquisitions also involve numerous risks, including, among others:
Our inability to overcome problems encountered in connection with such acquisitions could divert the attention of management, utilize scarce corporate resources and harm our business. In addition, we are unable to predict whether or when any prospective acquisition candidate will become available or the likelihood that any acquisition will be completed.
Product returns, price protection and order cancellations could reduce our revenues.
To the extent we manufacture products in anticipation of future demand that does not materialize, or in the event a customer cancels outstanding orders, we could experience an unanticipated increase in our inventory. A lack of consumer demand for our products may also cause increased product returns. A majority of our sales through aftermarket channels include limited rights to return unsold inventory.
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In addition, while we may not be contractually obligated to accept returned products, we may determine that it is in our best interest to accept returns in order to maintain good relations with our customers. Product returns would increase our inventory and reduce our revenues. We have had to write down inventory in the past for reasons such as obsolescence, excess quantities and declines in market value below our costs. These inventory write-downs were approximately $2.9 million in 2000. In addition, we offer some of our aftermarket customers limited price protection rights for inventories of our products held by them. If we reduce the list price of our products, these customers may receive credits from us. We incurred price protection charges of approximately $557,000 in 2000.
We are also subject to repurchase agreements with various financial institutions in connection with wholesale inventory financing. Under these agreements, we may be required to repurchase inventory upon customer default with a financing institution and then resell the inventory through normal distribution channels. As of December 31, 2000, we have not been required to repurchase inventory in connection with the customer default agreements noted above. However, it may be possible that we will be required to repurchase inventory, upon customer default, in the future. Sales under such agreements were approximately $2.7 million in 2000.
We have no long-term volume commitments from our customers. Sales of our products are made through individual purchase orders and, in certain cases, are made under master agreements governing the terms and conditions of the relationships. Customers may change, cancel or delay orders with limited or no penalties. We have experienced cancellations of orders and fluctuations in order levels from period-to-period and we expect to continue to experience similar cancellations and fluctuations in the future which could result in fluctuations in our revenues.
We may not be able to maintain or improve our competitive position because of the intense competition in the memory industry.
We conduct business in an industry characterized by intense competition, rapid technological change, evolving industry standards, declining average sales prices and rapid product obsolescence. Our competitors include many large domestic and international companies that have substantially greater financial, technical, marketing, distribution and other resources, broader product lines, lower cost structures, greater brand recognition and longer-standing relationships with customers and suppliers. As a result, our competitors may be able to respond better to new or emerging technologies or standards and to changes in customer requirements. Our competitors may also be able to devote greater resources to the development, promotion and sale of products, and may be able to deliver competitive products at a lower price.
We expect to face competition from existing competitors and new and emerging companies that may enter our existing or future markets with similar or alternative products which may be less costly or provide additional features. In addition, some of our significant suppliers are also our competitors, many of whom have the ability to manufacture competitive products at lower costs as a result of their higher levels of integration. We also face competition from current and prospective customers that evaluate our capabilities against the merits of manufacturing products internally. Competition may arise due to the development of cooperative relationships among our current and potential competitors or third partie